THERMAL MANAGEMENT散热材料

汇众电子提供一系列具有极高导热功能的产品。包括散热膏(脂),导热胶粘胶和导热封装材料。主要应用于电子及相关设备的散热,保证设备的稳定工作。

Wilkon offers a range of products with extremely high thermal conductivity, including thermal grease, thermal conductive adhesive and thermal encapsulation materials. These products are mainly used in thermal dissipation of electronic and related equipment to ensure stable operation of the device.

在电子电气领域,由于集成技术和微封装技术的发展,电子元件和设备向小型化与微型化发展,这种趋势的后果便是在有限的体积内产生了更多的热量,如果热量不能及时的散发,热量积聚过多将会导致元件工作温度升高,影响其正常工作,严重时还会使电子元件失效。统计资料表明电子元件温度每升高2℃,可靠性下降10 %;温升50℃时的寿命只有温升25℃时的1/6。

In the electrical and electronic fields, with the development of integration and micro-encapsulation technology, electronic components and equipment are more inclined to miniaturization and microminiaturization. The consequence of this trend is that more heat is generated within a limited volume. If the heat cannot be dissipated timely, excessive heat accumulation will cause rising working temperature of components, thus affecting its normal work and even causing electronic component failure. Statistics show that if the electronic component temperature is increased by 2℃, its reliability will be decreased by 10%; if temperature is increased by 50℃, its lifetime is only 1/6 compared with temperature increased by 25%.

通常会使用金属散热器消除部件间产生的热量,散热器形成较大的表面积或者是组件外部的一部分,热部件通常用机械方式连接金属。这种方式的局限是在结合处的间隙中存在空气。空气是热的不良导体,严重影响散热效率。通常会使用柔性导热材料填充这些空隙,去除空气。我们提供的产品具有优良的散热性能,保证热能以最快的速度从部件流到金属散热片。

Usually a metal heat sink will be used to dissipate the heat away generated by components. It will form a larger surface area or part of the external components. The thermal components are usually connected to the metal mechanically. The limitation of this approach is the presence of air in the gap at the junction. Air is a poor conductor of heat, and will seriously affect the thermal performance. A flexible thermally conductive material will be typically used to fill the gaps to remove air. Our products have excellent thermal performance, ensuring the heat flowing from components to the metal heat sinks in the fastest speed.

在太阳能采热系统中关键的问题是以最少的损耗最多地传导热量。为此,我们提供的超强热导膏(导热率大于3.0W/m.k)是解决该问题最理想的产品。

A key issue in the solar heating system is to transfer the most heat at minimal loss. Our superior thermal grease (thermal conductivity greater than 3.0W/m.k) is an ideal product to solve this problem.

汇众电子提供不含硅的散热剂,无硅导热脂是由无硅基础油和其他填料组成的膏状导热媒介材料。与传统的导热硅脂相比,无硅导热材料可以解决导热硅脂在使用过程中随着时间的推移而释放游离的硅份子并产生迁移的问题。

Wilkon provides silicon-free thermal grease, which is a thermally conductive grease composed of silicone-free base oils and other fillers. Compared with traditional thermal grease, silicone-free thermal grease can solve the problem of releasing dissociative silicon molecules and migration over time during the use of traditional thermal grease.

含硅导热材料所产生的迁移通常会为电子产品带来两种负面的影响,一种是使硅脂与散热器的连接面出现很多凹陷,降低与散热器的接触面积进而减弱材料的导热性能;另一种是游离硅份子会污染电子产品的开关触点,在高压下在触点的表面形成高绝缘氧化硅,导致触点接触不良。无硅导热材料常用于高技术以及高成本的电子,包括通讯和计算机等高精密的制造工业。

Migration generated by silicon-free thermally conductive material usually has two negative impacts on electronic products. One impact is that many indentations are generated on the junction surface of silicone grease and the heat sink, reducing the contact area with the heat sink and thus weakening the thermal conductivity of the material. Another impact is that dissociative silicon molecules will contaminate the switch contacts of electronic products. At high pressure, insulating silicon oxide will be formed on the contact surface, resulting in poor contacts. Silicon-free thermally conductive materials are commonly used in high-tech and high-cost electronics, including high-precision manufacturing industries like communications and computers.

导热型粘合胶具有优异的基材粘合强度。利用粘合胶的基材粘合性能和导热性能,能够牢固的将散热器固定在发热元件上并且提供散热功能。大部分这种材料为双组份和单组份结构。双组份结构的材料存储简单,价格便宜。而单组份结构则使用简单,但通常需要高温下进行固化。

Thermal conductive adhesive has excellent substrate adhesion strength. With its substrate adhesive property and thermal conductivity, the thermal conductive adhesive can fix the heat sink firmly on the heating element and provide thermal dissipation function. Most of these materials are two-part and one-part systems. Two-part materials are easy and cheap to store, while one-part materials are easy to use, but usually require high temperatures for curing.

除了传统的用于间隙填充的柔性导热剂或导热型粘合胶,汇众电子也提供一些具有高导热性能的用于浇注密封的树脂。这类型材料除了能够解决电子产品工作过程中可能出现的振动、防水和增强绝缘强度等功能外,还可以辅助解决电子产品的散热问题,例如个别使用了MOS管和大功率变压器的电子产品。

Apart from traditional flexible heat-transfer agents or thermal conductive adhesives for gap filling, Wilkon also provides resins with high thermal conductivity for pouring and sealing. This kind of material can ensure anti-vibration, waterproof and enhance dielectric strength during operation of the electronic products, but also assist in solving the thermal dissipation problem of electronic products, such as those using MOS tube and high-power transformer.

Non-Silicon Thermal Conductive Paste无硅导热脂
Silicone Heat Transfer Compound导热硅脂

CONTACT联系

 
自Wilkon成立以来,我们陆续跟多家实力雄厚的国有,军工企业,上市企业,民营企业或国际企业达成合作。我们的物料品质稳定,服务高效到位,我们的销售人员经过严格的培训,具有丰富的应用经验。这些都保证了Wilkon不断的获得更多的客户的信赖和认可。因此,任何化学材料方面的需求,请随时联系我们。
Since Wilkon's  foundation, we have established cooperation with a number of powerful state-owned enterprises, military enterprises, listed companies, private companies or international companies. We provide quality-stable materials and efficient service. Our sales staff has gone through rigorous training and has extensive application experience. These all guarantee that Wilkon constantly gets more customers’ trust and recognition. If there’s any inquiry on chemical materials, please feel free to contact us.
TEL:+86 0755-83665090
FAX: +86 0755-83682761
ADD: 深圳市龙华新区梅龙路优品文化创意园2栋208

TEL:+86 0755-83665090
WEB: www.wilkon.cn
Room 208, Block 2, Youpin Cultural Creative Park, Meilong Road, Longhua New District, Shenzhen